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드파트너
(반도체 생산
오퍼레이터)	ㆍ우리의 목표는 반도체 장비 조작을 통해
　반도체 생산 물량을 달성하는 것이며,
　이 목표를 위해 팀으로 일합니다.
ㆍ원재료(실리콘 웨이퍼)가 고객이 원하는
　전기적  특성을 갖는 제품(반도체)이 되도록
　매뉴얼에 따라 설비를 활용하여 화학적
　조치를 취하거나,
ㆍ출고 전 매뉴얼에 따라 제품 성능을
　검사하는 일을 합니다.	ㆍ만 18세 이상으로 고교 졸업자
　또는 전문학사 소지자
　(전공무관)
ㆍ교대근무 가능자
　(4조 3교대, 6일 근무 2일 휴무)
ㆍ방진복 착용 및 클린룸
　근무 가능자	ㆍ기본 연봉 2,970만원
 ㆍ연 3,800만원 수준
ㆍ기숙사, 통근버스
　본인 및 자녀
　학자금 지원

장애인 특별채용	ㆍ장애 정도에 따라 면접 시 상호 협의 후 직무 및 근무형태를 결정합니다.
　(필드파트너, 화공, 자재관리, 안전관리 등)

Device Engineer
(신입/경력)	ㆍIYM (Integrated Yield Management)
　- Process integration for mass production
　- Set KPI goal related to Yield performance
　  (Yield, Defect density, YLD saving$,...)
　- Failure analysis and problem solving in FAB & EDS
　  (Electrical Die Sorting )
　- Technology/process/product transfers
ㆍInterface between Assembly / Business Units and
　FAB contact window for site communication
　- Primary contact window for site communication
　  (Design - FAB - Ass’y - QA)
　- New product and process introduction to
　  manufacturing
　- Supporting PKG level yield / quality
　  issues & projects
　- Process Change Management	ㆍNeed verbal and written communication
　skills in English
ㆍNeed understanding of semiconductor
　fabrication process, basic device physics,
　statistics, DOE, and analytical skills
ㆍAbility to work with open mind and
　communication actively and share
　information effectively
ㆍGive priority to experienced applicant on
　statistical background and semiconductor
　process
ㆍBS in Electronics or Chemical, Material
　Engineering related subject to Semiconductor
　Process Engineering
Defects
Management
Engineer
(신입/경력)	ㆍDefects density management
ㆍParticle reduction activity with inspection tools
ㆍFactory quality control with defects management
ㆍTrouble solving a chronic defect
ㆍSupporting new device & new process
ㆍInteract collaboratively with Process, equipment,
　production
Epi Process
Engineer	ㆍControl process for productivity / quality / cost /
　technology
ㆍMake a plan for cost reduction, improving Cp & Cpk,
　solving a chronic unit process problems, optimizing
　unstable process condition, and supporting new
　device & new process
ㆍInteract collaboratively with device, equipment,
　production engineering
각 공정 별 설비
Technician
(신입/경력)	ㆍ반도체 장비의 유지보수 관리 / 신규 장비의
　설치 및 사양 관리
ㆍ반도체 장비의 PM 활동 및 프로세스 개선
ㆍ반도체 장비와 관련된 스크랩의 원인 분석 및 개선
ㆍ부품(Parts)의 소모 기간 개선 및 원가 절감 활동
ㆍ작업 환경 개선 (5S and EHS)	ㆍ전자, 전기, 반도체 관련 초대졸 이상
ㆍ 4조 2교대 근무 가능자
ㆍ대인 관계가 원만하고 다양한 레벨의 사람과
　일할 수 있는 능력
ㆍ기본적인 영어 말하기 및 쓰기 능력 /
　MS Office 및 Jump, Minitab
　통계프로그램 경험
ㆍ반도체 생산공정 및 반도체 장비에 대한
　기본적인 이해
Facility Technician	ㆍPCC : 기계 설비 유지보수 관리업무
　- Pump, blower, motor 등 회전기기 유지보수
　- Air compressor 유지보수
　- 냉동기 및 에어컨 유지보수
　- 진동 진단 및 판정
　- 기타 자동문 등 기계장치 관리	ㆍ자격 요건 : 기계 관련학과 초대졸 이상
ㆍ근무 형태 : Office 근무
　(향후 4조 2교대 근무 가능)
ㆍWWT : 폐수처리 관련 업무
　- 폐수처리 장비 조작, 운전 관리
　- 폐수처리 관련 시설물, 화공 약품 시설 안전 관리
　- 수처리 관련 수질 분석 및 data관리	ㆍ자격 요건 : 기계, 화공, 환경 관련 초대졸 이상
ㆍ근무 형태 : 4조 2교대 근무
Electronic Design
Engineer
(석사신입)	ㆍDefine Product (SiC, Low and High Voltage MOSFETs,
　IGBT, Gate Drive IC, PKG also) requirement
　Specification requirements for new products into
　communication with technical development
　engineering.
ㆍValidate Electrical performance evaluation through
　simulation and experiment as part of the Product
　Verification for system application.
ㆍDesign and build new test circuits and system for
　new device development support.	ㆍTechnical Skills
ㆍDeep knowledge in power semiconductors
　(SMPS) systems
　( Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
　especially Si & SiC MOSFET, IGBT, Gate Driver
　(HVIC and Galvanic)
ㆍEducation and Experience
ㆍPrefer MS or BS course graduated with
　Power Electronics.
ㆍUnderstanding Power Electronics and Power
　Semiconductor Device.
Image Sensor
Digital Engineer
(학부 및 석사신입
지원가능)
*근무지 : 분당	ㆍThis position is responsible for image sensor
　development from RTL to test setup such as timing
　controller design, ISP, Synthesis, STA, Test
　development and etc.
ㆍLogic Design / Back-End Processes / Functional
　verification of several million gate ASICs, setup
　verification environments	ㆍFamiliar with digital design flow, image sensor
　digital design and verification
ㆍincluding verilog RTL coding/simulation,
　synthesis, static timing analysis, and formality.
ㆍUse C, C++, MATLAB, Perl programming
　language for design verification or modeling.
Auto Application
Engineer
(석사신입 가능)	ㆍDefine Product (SiC, Low and High Voltage
　MOSFETs, IGBT, Gate Drive IC, PKG also) requirement
　Specification requirements for new products into
　communication with technical development
　engineering
ㆍIn-depth knowledge related automotive application
　such as OBC and Motor drive system with strong
　analytical and problem solving skills.	ㆍDeep knowledge in power semiconductors
　(SMPS) systems
　(Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
　especially Si & SiC MOSFET, IGBT, Gate Driver
　(HVIC and Galvanic)
ㆍPrefer MS course with related company
　experience or BS course graduated with Power
　Electronics/Power Semiconductor with related
　company experience
ㆍUnderstanding Power Electronics and Power
　Semiconductor Device
APM Product
Marketing
Engineer	ㆍFeasibility study of a new product at product
　concept stage
ㆍSelection for proper technology, die size estimation,
　risk analysis, development schedule
ㆍUnderstanding of design spec in addition to system
　requirement
ㆍPlan for IC design and verification	ㆍBS or MS in Electric/Electronic engineering
ㆍ5 years experience of IC development
ㆍUnderstanding of device physics and power
　technology
ㆍExperience of IC design from sub block level
　design to top level design/verification
ㆍSkill of DFM(PVT corner sim, Monte Carlo)
　methodology, parasitic analysis
　(layout, package)
ㆍSkill of design and layout tools
　(Cadence, Mentor)
APM Product
Engineer	ㆍProduct engineers - representing the BU to provide
　product engineering support to customer, work with
　manufacturing and quality engineering teams to
　improve quality, cost, on-time delivery (OTD) of the
　assigned product lines.
ㆍThe engineer will mainly support Auto SiC &
　Module products and be the main interface btw the
　business Unit and manufacturing both front end
　(FAB) and back end (Assembly/Final Test sites) on
　product related matters.	ㆍ~3 year experience as device engineer or
　product engineer, other similar experiences in
　semiconductor industry.
ㆍNice to have the experience for
　supporting/resolving Semiconductor
　production issues such as yield/parametric
　data analysis and disposition, Manufacturing/
　customer support, Product yield improvement,
　test time & cost reduction projects, process
　enhancement.
ㆍPrefer MS course with related company
　experience or BS course graduated related to
　Power Electronics/Power Semiconductor with
　related company experience
ㆍUnderstanding Power Electronics and Power
　Semiconductor Device
Automotive
products
Applications
Engineer	ㆍWork with a team of Automotive products
　Applications Engineers supporting BU objectives
ㆍDefine Product (SiC, Low and High Voltage
　MOSFETs, IGBT, Gate Drive IC, PKG also)
　requirement Specification requirements for new
　products into communication with technical
　development engineering
ㆍProvide collateral material: datasheets, applications
　notes, and user guides	ㆍDeep knowledge in power semiconductors
　(SMPS) systems
　(Fly back, CCM, DCM, PFC, LLC )
ㆍDeep knowledge of semiconductor device,
　especially Si & SiC MOSFET, IGBT, Gate Driver
　(HVIC and Galvanic)
ㆍPrefer MS course with related company
　experience or BS course graduated with Power
　Electronics/Power Semiconductor with related
　company experience
ㆍUnderstanding Power Electronics and Power
　Semiconductor Device
NPD Layout
Design Enginee	ㆍLayout support for NPD project
ㆍSiC derivative technology development from the
　proven new technology.
ㆍTechnical support for issues in production	ㆍAbove BS degree if possible
ㆍ5-8 years of experience in semiconductor
　layout
ㆍProfessional in Cadence layout tools
Test Engineer	ㆍResponsible for sort & final test trouble shooting,
　program development, yield improvement, PQA
　Analysis of Discrete product.
ㆍDevelop and release to manufacturing test solutions
　utilizing Eagle ETS200T,ETS364B, TESEC SP20, and
　other MOSFET/IGBT ATE pl atf orms.
ㆍCost saving activity through test time reduction.
ㆍYield improvement, manufacturing ramp and
　throughput optimization of new products.
ㆍSort data analysis by PDF Exensio YMS system.
ㆍTest development projects such as ultra low
　resistance (Rdson)
ㆍMeasurement static and dynamic(UIL/SW/ Rg)
　test coverage
ㆍOptimization/improvement, and test efficiency
　improvement for high performance and multi site
　testing, high current/voltage test ing.	ㆍ학력 : 대졸이상 (졸업예정자 가능)
ㆍUnderstanding of basic semiconductor
　physical properties and electronic circuit.
ㆍExcellent inter personal skills, able to work well
　with different levels of people.
ㆍNeed oral and written communication skills,
　including presentation skills in English
ㆍGood software skill and knowledge (Excel,
　Word, PowerPoint, Jump, Minitab, C++, etc.)

체험형 인턴

ㆍ자격 요건: 전자, 전기 반도체 등 학사 이상 졸업 예정자 또는 졸업자(6개월 풀타임 근무 필수)
ㆍ처우 내용: 월 급여 220여만원 + 기타 사내 식당 및 기숙사 제공.
ㆍ본 공고는 체험 형 Device Engineer 인턴으로서 정규직 전환형이 아님을 안내드립니다.

Device Engineer	ㆍIYM (Integrated Yield Management)
　- Process integration for mass production
　- Set KPI goal related to Yield performance
　  (Yield, Defect density, YLD saving$,...)
　- Failure analysis and problem solving in FAB & EDS
　  (Electrical Die Sorting )
　- Technology/process/product transfers	ㆍNeed verbal and written communication
　skills in English
ㆍNeed understanding of semiconductor
　fabrication process, basic device physics,
　statistics, DOE, and analytical skills
ㆍAbility to work with open mind and
　communication actively and share information
　effectively
ㆍGive priority to experienced applicant on
　statistical background and semiconductor
　process
ㆍBS in Electronics or Chemical, Material
　Engineering related subject to Semiconductor
　Process Engineering

설 안전관리자
( 1 year contract )	ㆍ당사의 신축 반도체 공장 건설 및 remodeling
　공사 현장의 안전관리 업무를 주로 수행하며 당사
　공사 안전관리자를 보좌하고 또한 상주 안전관리
　업체를 통제 관리합니다.
　- 반도체 공장 건설 및 개보수 공사 현장의
　  공사 안전관리 업무
　- 안전관리 대행 업체 관리
　- 당사 공사 안전관리자를 보좌하는 업무
　- 공사 현장 risk 발굴 개선	ㆍ전공 무관
ㆍ전문대 또는 이와 동등 수준 이상의
　산업안전 관련학과 및 이과계열 우대
ㆍ건설 안전관리 경력 5년 이상
ㆍ건설현장 경력 5년이상 (공사 종류 무관)
ㆍ건설안전 자격증 소지자 우대

기타사항

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