필드파트너/장애인특별채용/Device Engineer/Defects Management Engineer/각 공정 별 설비등0 명 모집

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모집요강

모집직종	생산·품질관리
직종키워드	필드파트너/장애인특별채용/Device Engineer/Defects Management Engineer/각 공정 별 설비등
직무내용	드파트너 (반도체 생산 오퍼레이터) ㆍ우리의 목표는 반도체 장비 조작을 통해 　반도체 생산 물량을 달성하는 것이며, 　이 목표를 위해 팀으로 일합니다. ㆍ원재료(실리콘 웨이퍼)가 고객이 원하는 　전기적 특성을 갖는 제품(반도체)이 되도록 　매뉴얼에 따라 설비를 활용하여 화학적 　조치를 취하거나, ㆍ출고 전 매뉴얼에 따라 제품 성능을 　검사하는 일을 합니다. ㆍ만 18세 이상으로 고교 졸업자 　또는 전문학사 소지자 　(전공무관) ㆍ교대근무 가능자 　(4조 3교대, 6일 근무 2일 휴무) ㆍ방진복 착용 및 클린룸 　근무 가능자 ㆍ기본 연봉 2,970만원 ㆍ연 3,800만원 수준 ㆍ기숙사, 통근버스 　본인 및 자녀 　학자금 지원 장애인 특별채용 ㆍ장애 정도에 따라 면접 시 상호 협의 후 직무 및 근무형태를 결정합니다. 　(필드파트너, 화공, 자재관리, 안전관리 등) Device Engineer (신입/경력) ㆍIYM (Integrated Yield Management) 　- Process integration for mass production 　- Set KPI goal related to Yield performance 　 (Yield, Defect density, YLD saving$,...) 　- Failure analysis and problem solving in FAB & EDS 　 (Electrical Die Sorting ) 　- Technology/process/product transfers ㆍInterface between Assembly / Business Units and 　FAB contact window for site communication 　- Primary contact window for site communication 　 (Design - FAB - Ass’y - QA) 　- New product and process introduction to 　 manufacturing 　- Supporting PKG level yield / quality 　 issues & projects 　- Process Change Management ㆍNeed verbal and written communication 　skills in English ㆍNeed understanding of semiconductor 　fabrication process, basic device physics, 　statistics, DOE, and analytical skills ㆍAbility to work with open mind and 　communication actively and share 　information effectively ㆍGive priority to experienced applicant on 　statistical background and semiconductor 　process ㆍBS in Electronics or Chemical, Material 　Engineering related subject to Semiconductor 　Process Engineering Defects Management Engineer (신입/경력) ㆍDefects density management ㆍParticle reduction activity with inspection tools ㆍFactory quality control with defects management ㆍTrouble solving a chronic defect ㆍSupporting new device & new process ㆍInteract collaboratively with Process, equipment, 　production Epi Process Engineer ㆍControl process for productivity / quality / cost / 　technology ㆍMake a plan for cost reduction, improving Cp & Cpk, 　solving a chronic unit process problems, optimizing 　unstable process condition, and supporting new 　device & new process ㆍInteract collaboratively with device, equipment, 　production engineering 각 공정 별 설비 Technician (신입/경력) ㆍ반도체 장비의 유지보수 관리 / 신규 장비의 　설치 및 사양 관리 ㆍ반도체 장비의 PM 활동 및 프로세스 개선 ㆍ반도체 장비와 관련된 스크랩의 원인 분석 및 개선 ㆍ부품(Parts)의 소모 기간 개선 및 원가 절감 활동 ㆍ작업 환경 개선 (5S and EHS) ㆍ전자, 전기, 반도체 관련 초대졸 이상 ㆍ 4조 2교대 근무 가능자 ㆍ대인 관계가 원만하고 다양한 레벨의 사람과 　일할 수 있는 능력 ㆍ기본적인 영어 말하기 및 쓰기 능력 / 　MS Office 및 Jump, Minitab 　통계프로그램 경험 ㆍ반도체 생산공정 및 반도체 장비에 대한 　기본적인 이해 Facility Technician ㆍPCC : 기계 설비 유지보수 관리업무 　- Pump, blower, motor 등 회전기기 유지보수 　- Air compressor 유지보수 　- 냉동기 및 에어컨 유지보수 　- 진동 진단 및 판정 　- 기타 자동문 등 기계장치 관리 ㆍ자격 요건 : 기계 관련학과 초대졸 이상 ㆍ근무 형태 : Office 근무 　(향후 4조 2교대 근무 가능) ㆍWWT : 폐수처리 관련 업무 　- 폐수처리 장비 조작, 운전 관리 　- 폐수처리 관련 시설물, 화공 약품 시설 안전 관리 　- 수처리 관련 수질 분석 및 data관리 ㆍ자격 요건 : 기계, 화공, 환경 관련 초대졸 이상 ㆍ근무 형태 : 4조 2교대 근무 Electronic Design Engineer (석사신입) ㆍDefine Product (SiC, Low and High Voltage MOSFETs, 　IGBT, Gate Drive IC, PKG also) requirement 　Specification requirements for new products into 　communication with technical development 　engineering. ㆍValidate Electrical performance evaluation through 　simulation and experiment as part of the Product 　Verification for system application. ㆍDesign and build new test circuits and system for 　new device development support. ㆍTechnical Skills ㆍDeep knowledge in power semiconductors 　(SMPS) systems 　( Fly back, CCM, DCM, PFC, LLC ) ㆍDeep knowledge of semiconductor device, 　especially Si & SiC MOSFET, IGBT, Gate Driver 　(HVIC and Galvanic) ㆍEducation and Experience ㆍPrefer MS or BS course graduated with 　Power Electronics. ㆍUnderstanding Power Electronics and Power 　Semiconductor Device. Image Sensor Digital Engineer (학부 및 석사신입 지원가능) *근무지 : 분당 ㆍThis position is responsible for image sensor 　development from RTL to test setup such as timing 　controller design, ISP, Synthesis, STA, Test 　development and etc. ㆍLogic Design / Back-End Processes / Functional 　verification of several million gate ASICs, setup 　verification environments ㆍFamiliar with digital design flow, image sensor 　digital design and verification ㆍincluding verilog RTL coding/simulation, 　synthesis, static timing analysis, and formality. ㆍUse C, C++, MATLAB, Perl programming 　language for design verification or modeling. Auto Application Engineer (석사신입 가능) ㆍDefine Product (SiC, Low and High Voltage 　MOSFETs, IGBT, Gate Drive IC, PKG also) requirement 　Specification requirements for new products into 　communication with technical development 　engineering ㆍIn-depth knowledge related automotive application 　such as OBC and Motor drive system with strong 　analytical and problem solving skills. ㆍDeep knowledge in power semiconductors 　(SMPS) systems 　(Fly back, CCM, DCM, PFC, LLC ) ㆍDeep knowledge of semiconductor device, 　especially Si & SiC MOSFET, IGBT, Gate Driver 　(HVIC and Galvanic) ㆍPrefer MS course with related company 　experience or BS course graduated with Power 　Electronics/Power Semiconductor with related 　company experience ㆍUnderstanding Power Electronics and Power 　Semiconductor Device APM Product Marketing Engineer ㆍFeasibility study of a new product at product 　concept stage ㆍSelection for proper technology, die size estimation, 　risk analysis, development schedule ㆍUnderstanding of design spec in addition to system 　requirement ㆍPlan for IC design and verification ㆍBS or MS in Electric/Electronic engineering ㆍ5 years experience of IC development ㆍUnderstanding of device physics and power 　technology ㆍExperience of IC design from sub block level 　design to top level design/verification ㆍSkill of DFM(PVT corner sim, Monte Carlo) 　methodology, parasitic analysis 　(layout, package) ㆍSkill of design and layout tools 　(Cadence, Mentor) APM Product Engineer ㆍProduct engineers - representing the BU to provide 　product engineering support to customer, work with 　manufacturing and quality engineering teams to 　improve quality, cost, on-time delivery (OTD) of the 　assigned product lines. ㆍThe engineer will mainly support Auto SiC & 　Module products and be the main interface btw the 　business Unit and manufacturing both front end 　(FAB) and back end (Assembly/Final Test sites) on 　product related matters. ㆍ~3 year experience as device engineer or 　product engineer, other similar experiences in 　semiconductor industry. ㆍNice to have the experience for 　supporting/resolving Semiconductor 　production issues such as yield/parametric 　data analysis and disposition, Manufacturing/ 　customer support, Product yield improvement, 　test time & cost reduction projects, process 　enhancement. ㆍPrefer MS course with related company 　experience or BS course graduated related to 　Power Electronics/Power Semiconductor with 　related company experience ㆍUnderstanding Power Electronics and Power 　Semiconductor Device Automotive products Applications Engineer ㆍWork with a team of Automotive products 　Applications Engineers supporting BU objectives ㆍDefine Product (SiC, Low and High Voltage 　MOSFETs, IGBT, Gate Drive IC, PKG also) 　requirement Specification requirements for new 　products into communication with technical 　development engineering ㆍProvide collateral material: datasheets, applications 　notes, and user guides ㆍDeep knowledge in power semiconductors 　(SMPS) systems 　(Fly back, CCM, DCM, PFC, LLC ) ㆍDeep knowledge of semiconductor device, 　especially Si & SiC MOSFET, IGBT, Gate Driver 　(HVIC and Galvanic) ㆍPrefer MS course with related company 　experience or BS course graduated with Power 　Electronics/Power Semiconductor with related 　company experience ㆍUnderstanding Power Electronics and Power 　Semiconductor Device NPD Layout Design Enginee ㆍLayout support for NPD project ㆍSiC derivative technology development from the 　proven new technology. ㆍTechnical support for issues in production ㆍAbove BS degree if possible ㆍ5-8 years of experience in semiconductor 　layout ㆍProfessional in Cadence layout tools Test Engineer ㆍResponsible for sort & final test trouble shooting, 　program development, yield improvement, PQA 　Analysis of Discrete product. ㆍDevelop and release to manufacturing test solutions 　utilizing Eagle ETS200T,ETS364B, TESEC SP20, and 　other MOSFET/IGBT ATE pl atf orms. ㆍCost saving activity through test time reduction. ㆍYield improvement, manufacturing ramp and 　throughput optimization of new products. ㆍSort data analysis by PDF Exensio YMS system. ㆍTest development projects such as ultra low 　resistance (Rdson) ㆍMeasurement static and dynamic(UIL/SW/ Rg) 　test coverage ㆍOptimization/improvement, and test efficiency 　improvement for high performance and multi site 　testing, high current/voltage test ing. ㆍ학력 : 대졸이상 (졸업예정자 가능) ㆍUnderstanding of basic semiconductor 　physical properties and electronic circuit. ㆍExcellent inter personal skills, able to work well 　with different levels of people. ㆍNeed oral and written communication skills, 　including presentation skills in English ㆍGood software skill and knowledge (Excel, 　Word, PowerPoint, Jump, Minitab, C++, etc.) 체험형 인턴 ㆍ자격 요건: 전자, 전기 반도체 등 학사 이상 졸업 예정자 또는 졸업자(6개월 풀타임 근무 필수) ㆍ처우 내용: 월 급여 220여만원 + 기타 사내 식당 및 기숙사 제공. ㆍ본 공고는 체험 형 Device Engineer 인턴으로서 정규직 전환형이 아님을 안내드립니다. Device Engineer ㆍIYM (Integrated Yield Management) 　- Process integration for mass production 　- Set KPI goal related to Yield performance 　 (Yield, Defect density, YLD saving$,...) 　- Failure analysis and problem solving in FAB & EDS 　 (Electrical Die Sorting ) 　- Technology/process/product transfers ㆍNeed verbal and written communication 　skills in English ㆍNeed understanding of semiconductor 　fabrication process, basic device physics, 　statistics, DOE, and analytical skills ㆍAbility to work with open mind and 　communication actively and share information 　effectively ㆍGive priority to experienced applicant on 　statistical background and semiconductor 　process ㆍBS in Electronics or Chemical, Material 　Engineering related subject to Semiconductor 　Process Engineering 설 안전관리자 ( 1 year contract ) ㆍ당사의 신축 반도체 공장 건설 및 remodeling 　공사 현장의 안전관리 업무를 주로 수행하며 당사 　공사 안전관리자를 보좌하고 또한 상주 안전관리 　업체를 통제 관리합니다. 　- 반도체 공장 건설 및 개보수 공사 현장의 　 공사 안전관리 업무 　- 안전관리 대행 업체 관리 　- 당사 공사 안전관리자를 보좌하는 업무 　- 공사 현장 risk 발굴 개선 ㆍ전공 무관 ㆍ전문대 또는 이와 동등 수준 이상의 　산업안전 관련학과 및 이과계열 우대 ㆍ건설 안전관리 경력 5년 이상 ㆍ건설현장 경력 5년이상 (공사 종류 무관) ㆍ건설안전 자격증 소지자 우대
접수마감일	2022.08.17
고용형태 *	정규직 계약직 프리랜서 인턴직 파견직 병역특례
급여조건*	협의 후 결정(nego)
학력	무관 , 전공무관